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Effects of different accelerators on copper electrodeposition mechanism and through-hole filling performance
更新时间：2026-08-23

    • Effects of different accelerators on copper electrodeposition mechanism and through-hole filling performance

    • Chemical Industry and Engineering Progress   (2026)

    • DOI：10.16085/j.issn.1000-6613.2026-0824    

      CLC： TQ153.14

    • Received：25 May 2026，

      Revised：2026-08-13，

      Accepted：15 August 2026，

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  • WANG Juan, LIU Zonglin, Yang Wenyao, et al. Effects of different accelerators on copper electrodeposition mechanism and through-hole filling performance[J/OL]. Chemical Industry and Engineering Progress, 2026. DOI： 10.16085/j.issn.1000-6613.2026-0824.

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